Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

March 8, 2022

Authors: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, and Ali Roshanghias

Link: Electronics | Free Full-Text | Die-Level Thinning for Flip-Chip Integration on Flexible Substrates (mdpi.com)

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