Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

December 20, 2022

Link: https://www.mdpi.com/2079-9292/11/6/849
Authors: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, Ali Roshanghias

 

 

back to publications