Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives

June 21, 2021

Malik, M.H., Grosso, G., Zangl, H., Binder, A. and Roshanghias, A., 2021. Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects…

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