New Publication in Electronics Journal
March 8, 2022
Title: Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Authors: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, and Ali Roshanghias
Title: Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Authors: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, and Ali Roshanghias