Bringing Science and Industry together
March 17, 2022
Talk 2: CFFT presentation. Bringing Science and Industry together
New Publication in Electronics Journal
March 8, 2022
Title: Die-Level Thinning for Flip-Chip Integration on Flexible Substrates Authors: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, and Ali Roshanghias Link:…
Best Sensors and Materials Young Researcher Paper Award 2021
March 8, 2022
Congratulate Akhil Chandran and Prof. Goran Stojanovic for receiving best paper award from Sensors and Materials . Sensors and Materials annually presents a S&M…
Bringing Science and Industry together
March 8, 2022
Talk 3: Lallemand Industry I4.0 based production in Biotechnology Companies
Bringing Science and Industry together
March 8, 2022
Talk 1: Innovation and entrepreneurship