Ene

Bringing Science and Industry together

March 17, 2022

Talk 2: CFFT presentation. Bringing Science and Industry together

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New Publication in Electronics Journal

March 8, 2022

Title: Die-Level Thinning for Flip-Chip Integration on Flexible Substrates Authors: Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, and Ali Roshanghias Link:…

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Certificate Akhil Chandran

Best Sensors and Materials Young Researcher Paper Award 2021

March 8, 2022

Congratulate Akhil Chandran and Prof. Goran Stojanovic for receiving best paper award from Sensors and Materials .   Sensors and Materials annually presents a S&M…

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Iidar

Bringing Science and Industry together

March 8, 2022

Talk 3: Lallemand Industry I4.0 based production in Biotechnology Companies

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Prof. Karo

Bringing Science and Industry together

March 8, 2022

Talk 1: Innovation and entrepreneurship

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