Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
June 21, 2021
We are happy to share our new paper demonstrating the bending radius and electrical performance of ultra-thinned dies in a variety of thicknesses down to 10 μm bonded to paper and PET substrates:
https://doi.org/10.1016/j.microrel.2021.114204