1 S2.0 S0026271421x00078 Cov200h

Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives

June 21, 2021

We are happy to share our new paper demonstrating the bending radius and electrical performance of ultra-thinned dies in a variety of thicknesses down to…

read more