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Dr. Srinjoy Mitra

Dr. Srinjoy Mitra

Dr. Srinjoy Mitra


Srinjoy Mitra received his B.S. degree in physics and electronics from Calcutta, India and his M.Tech. degree from the Indian Institute of Technology, Bombay, India. After spending a short time in electronics industry he received his Ph.D. from the Institute of Neuroinformatics, ETH Zurich in 2004. Between 2008 and 2010 he worked as a post-doctoral researcher at Johns Hopkins University, Baltimore, USA. He then joined the medical electronics team at IMEC, Belgium and worked there as a senior scientist until early 2016. At IMEC he had taken up lead roles in various projects related to bio-potential recording. Electro-encephalography (EEG) measurement ICs developed by him have been successfully validated in clinical environment and are now commercialized. For the last few years Dr. Mitra led multiple projects on neural implants for central and peripheral nervous system. Dr. Mitra returned to academia as a Lecturer in the Biomedical Engineering Division at the University of Glasgow. In 2017 he moved to the Institute for Integrated Micro and Nano Sensors, University of Edinburgh as a Senior Lecturer (Associate Professor).


RP7: Readout electronics for sensor interface (ESR7, UEDIN)
The multisensory system requires a dedicated readout electronics, which is designed for wide range of operation (e.g. in terms of temperature, pressure etc.). ESR7 will design low-power sensor interface with blocks for sensing, digitization and wireless communication. The chips will be fabricated in a standard CMOS process and for better integration they will be thinned down to ultra-thin regime (<40┬Ám). This will add new dimension to conventional CMOS technology and thinned chips can also conform to curved surfaces. Various thinning techniques like back-grinding, dry/wet etching etc. will be investigated depending on the chip specification and requirements. Once the system is developed, the performance will be evaluated, and the data will be wirelessly transmitted to the data collection unit. A modular approach for sensors and signal processing electronics will be implemented. Initially off-the-shelf components will be used. The necessary bias and reference circuits to the drive the sensors will be studied and the issues with temperature will be investigated. Custom sensors will be tested using high- precision amplifiers such as INA338. In parallel, the analogue frontend (AFE) signal processing blocks will be developed, such that they can also withstand the harsh environmental conditions. The read-out-electronics will be characterized both with wired and wireless condition to detect the limitations of intermittent and variable power supply.


University of Edinburgh