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RP8: Integration on flexible substrates (ESR8, SAL)

RP8: Integration on flexible substrates (ESR8, SAL)


Plastic electronics, thin-film-transistors on foil and ultra-thin chips (UTC) on foil are technologies currently pursued to support the strongly emerging flexible electronics market. To achieve this, the development of autonomous multi-sensory systems also requires strategy for integrate various sensing and electronic components on flexible packages which are suitable for water quality monitoring and easy to manufacture. This project will develop conductive structures on various flexible substrates, ink-jet printing of functional layers, UV-curing processes of metal inks and metal layers on low temperature substrates, as well as the bonding and accurate placement of UTCs and sensors.

PI (supervisor) Name
Lead Institution

Silicon Austria Labs (SAL)


Villach, Austria